In this study, dc magnetron sputtered NiO (50 nm)/Co (2.5 nm)/Cu(1.5 nm)/Co
(3.0 nm) bottom spin valves were studied with and without Ag as a surfacta
nt. At Cu spacer thickness of 1.5 nm, a strong positive coupling > 13.92 kA
/m (> 175 Oe) between NiO-pinned and "free" Co layers leads to a negligible
giant magnetoresistance (GMR) effect (<0.7%) in Ag-free samples. In contra
st, spin valves deposited in the presence of approximate to1 monolayer of s
urfactant Ag have sufficiently reduced coupling, 5.65 kA/m (71 Oe), which r
esults in an order of magnitude increase in GMR (8.5%). Using transmission
electron microscopy (TEM), the large positive coupling in Ag-free samples c
ould directly be attributed to the presence of numerous pinholes. In situ x
-ray photoelectron spectroscopy shows that, in Ag-containing samples, the l
arge mobile Ag atoms float out to the surface during successive growth of C
o and Cu layers. Detailed TEM studies show that surfactant Ag leaves behind
smoother interfaces less prone to pinholes. The use of surfactants also il
lustrates their efficacy in favorably altering the magnetic characteristics
of GMR spin valves, and their potential use in other magnetoelectronics de
vices and multilayer systems. (C) 2001 American Institute of Physics.