We have investigated the use of ultrathin Al2O3 barriers to fabricate low-r
esistance tunnel-valve sensors suitable for recording heads. Tunnel valves
of the type underlayer/(IrMn or PtMn)/CoFe/Al2O3/CoFe/NiFe/Cap layer have b
een fabricated by magnetron sputtering. Tunnel barriers are formed by Al me
tal deposition followed by in situ oxidation, and tunnel-junction test devi
ces are built by photolithography with areas down to 1 x 1 mum(2). Specific
resistances as low as 13 Ohm mum(2) with 25% tunnel magnetoresistance have
been obtained using Al thicknesses of 6-7 Angstrom. (C) 2001 American Inst
itute of Physics.