Sodium silicate based thermal interface material for high thermal contact conductances (vol 122, pg 128, 2000)

Authors
Xu, YS Luo, XC Chung, DDL
Citation
Ys. Xu et al., Sodium silicate based thermal interface material for high thermal contact conductances (vol 122, pg 128, 2000), J ELEC PACK, 123(2), 2001, pp. 159-159
Citations number
1
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF ELECTRONIC PACKAGING
ISSN journal
10437398 → ACNP
Volume
123
Issue
2
Year of publication
2001
Pages
159 - 159
Database
ISI
SICI code
1043-7398(200106)123:2<159:SSBTIM>2.0.ZU;2-Q