The effect of Bi concentration on wettability of Cu substrate by Sn-Bi solders

In the present work, the wettability and interfacial tension between Cu-sub strate and Sn-Bi solder were examined. The variables of this experiment use d the content of Bi, types of flux and soldering temperature. Through analy zing the experimental result concerning wettability, it was found that the role of Bi was diminishing wettability of Cu substrate during soldering. Th e increasing Bi contents made liquid solder-Cu substrate interfacial tensio n (gamma (sl)) go up. Consequently, the increasing liquid solder-Cu substra te interfacial tension (gamma (sl)) led to the degradation of wettability i n solder. The rates of wetting can be controlled by the interfacial energy between liquid solder and substrate. This paper describes the effect of Bi element on the wettability of Sn-Bi solders.