Using a remote plasma chemical vapor deposition (RPCVD) system, we deposite
d microcrystalline silicon (muc-Si) films on CaF2 film coated glass substra
tes. The X-ray diffraction analysis showed that the CaF2 films grew in a (2
20) preferential orientation while the muc-Si films were oriented in the (1
11) and the (220) planes. Employing a CaF2 seed layer. we successfully prod
uced a high-quality muc-Si film with the following characteristic parameter
s: a grain size as large as 700 Angstrom. a crystalline volume fraction ove
r 65 %. a dark- and photo-conductivity ratio less than 124: amid an activat
ion energy around 0.49 eV. Our achievements regarding direct muc-Si film gr
owth at a low process temperature promise an improved thin film transistor
(TFT) operation speed, a high aperture ratio, and a stable light sensitivit
y in large-area TFT liquid crystal display (LCD) applications.