We have investigated the metal-ferroelectric-insulator-semiconductor (MFIS)
structure with strontium bismuth tantalate (SBT) as the ferroelectric thin
film and ZrO2 as the insulating buffer layer. Sr0.8Bi2.4Ta2O9 thin films w
ere prepared by using the metalorganic decomposition (MOD) method, and ZrO2
films were deposited using rf-sputtering. The memory windows of the MFIS s
tructure were in the range of 0.3 similar to 2.6 V for gate voltages from 3
to 10 V. The maximum memory window was observed in the MFIS with a 28-nm-t
hick ZrO2 layer. The auger electron spectroscopy (AES) depth profile and hi
gh-resolution transmission electron microscopy of the SBT/ZrO2 (28 nm)/Si s
tructure showed that the ZrO2 thin-film buffer layers prevented both the fo
rmation of an interfacial layer and interdiffusion between SET and Si.