Rapid power cycling of flip-chip and CSP components on ceramic substrates

Power cycling has been done for flip-chip and CSP components solder joined onto ceramic substrates. Cycle periods as short as 1 min were applied in th e experiments where the chip temperature varied between about 30 degreesC i n the power off-state and 100-150 degreesC in the power on-state. Disconnec tions of the joints were found after 4000-17000 power cycles. The flip-chip components joined onto low temperature cofired ceramic substrate showed sl ightly better reliability than the components joined onto alumina substrate . Most of the samples showed clear effects of deterioration of the joints s een as increasing chip temperature for power on-state. The experimental res ults are compared with calculations based on modified Coffin-Manson equatio n as well as with one-dimensional simulations. (C) 2001 Elsevier Science Lt d. All rights reserved.