Small amounts of alloying elements can significantly retard electromigratio
n in conductor lines. This phenomenon is experimentally well established bu
t is still lacking a fundamental explanation. An atomic-level mechanism for
this behavior is proposed here which is based on a kinetic analysis of dif
fusion in crystalline interfaces, it predicts a reduction or reversal of th
e Bur of host atoms for physically reasonable parameters and can account fo
r the observed effect of copper on electromigration in aluminum conductor l
ines.