Gold wire bonding to nickel palladium plated leadframes

Authors
Fan, C Xu, C Abys, JA Blair, A Chinchankar, V
Citation
C. Fan et al., Gold wire bonding to nickel palladium plated leadframes, PLAT SURF F, 88(7), 2001, pp. 54-58
Citations number
18
Categorie Soggetti
Metallurgy
Journal title
PLATING AND SURFACE FINISHING
ISSN journal
03603164 → ACNP
Volume
88
Issue
7
Year of publication
2001
Pages
54 - 58
Database
ISI
SICI code
0360-3164(200107)88:7<54:GWBTNP>2.0.ZU;2-V
Abstract
Gold wire bonding on palladium pre-plated leadframes was investigated. This surface finish demonstrates excellent wirebonding performance meeting indu stry requirements and is comparable with gold surface finishes.