Monte Carlo simulations of pattern-dependent charging during oxide etc
hing predict that the etch rate scaling with aspect ratio breaks down
when surface discharge currents are significant. Under conditions of i
on-limited etching and no inhibitor deposition, the etch depth depends
on the maximum incident ion energy, reaction threshold, and surface d
ischarge threshold, and is the same irrespective of the trench width (
less than or equal to 0.5 mu m). (C) 1997 American Institute of Physic
s.