ASPECT RATIO INDEPENDENT ETCHING OF DIELECTRICS

Citation
Gs. Hwang et Kp. Giapis, ASPECT RATIO INDEPENDENT ETCHING OF DIELECTRICS, Applied physics letters, 71(4), 1997, pp. 458-460
Citations number
14
Categorie Soggetti
Physics, Applied
Journal title
ISSN journal
00036951
Volume
71
Issue
4
Year of publication
1997
Pages
458 - 460
Database
ISI
SICI code
0003-6951(1997)71:4<458:ARIEOD>2.0.ZU;2-L
Abstract
Monte Carlo simulations of pattern-dependent charging during oxide etc hing predict that the etch rate scaling with aspect ratio breaks down when surface discharge currents are significant. Under conditions of i on-limited etching and no inhibitor deposition, the etch depth depends on the maximum incident ion energy, reaction threshold, and surface d ischarge threshold, and is the same irrespective of the trench width ( less than or equal to 0.5 mu m). (C) 1997 American Institute of Physic s.