Requirements of power supply parameters for high-power pulsed magnetron sputtering

In the last few years, a new sputter process technology called pulsed magne tron sputtering (PMS) has been developed and has become relevant for indust rial applications of large-area coating. The combination of a pulsed power supply and a dual magnetron sputter (DMS) system enables the deposition of insulating layers, such as Al2O3 SiO2, ZnO and SnO2, with high rates as DC sputtering. The pulsed magnetron sputtering process in conjunction with hig h power density requires intelligent process and are management. The intera ctions between process control and the dynamics of the power supply are des cribed by means of the deposition of tin oxide and zinc oxide. The meaning of process instabilities in the arcs were analyzed with V-I curves. A high- speed camera was used to observe the dual magnetron sputter system during a rcing. The dynamics of the coating system were characterized using the temp oral behavior of the oxygen partial pressure, which was measured with a lam bda probe. The result of the optimization of the system power-supply sputte r source is a deposition process with long-term stability. (C) 2001 Elsevie r Science B.V. All rights reserved.