Rf magnetron sputtering of polytetrafluoroethylene under various conditions

Citation
H. Biederman et al., Rf magnetron sputtering of polytetrafluoroethylene under various conditions, THIN SOL FI, 392(2), 2001, pp. 208-213
Citations number
18
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
392
Issue
2
Year of publication
2001
Pages
208 - 213
Database
ISI
SICI code
0040-6090(20010730)392:2<208:RMSOPU>2.0.ZU;2-Z
Abstract
Deposition of fluorocarbon plasma polymer films by means of rf sputtering o f polytetrafluoroethylene (PTFE) has been performed in argon, nitrogen and in a self-sputtering mode. The average temperature of the target was found to be below the melting point of PTFE. Energy resolved mass spectrometry re vealed the differences between the cases of argon and nitrogen working gase s. The CFN compound and increased concentration of CFx fragments were obser ved in the plasma using N-2. High resolution XPS analysis revealed CN in th ese films and enhanced amount of CF2 groups. Wettability by means of contac t angle of water droplet was assessed. Static contact angles approaching 10 5 degrees and 100 degrees were measured for fluorocarbon plasma polymer fil ms sputtered in argon and nitrogen, respectively. (C) 2001 Elsevier Science B.V. All rights reserved.