3-D self-assembling and actuation of electrostatic microstructures

Citation
E. Quevy et al., 3-D self-assembling and actuation of electrostatic microstructures, IEEE DEVICE, 48(8), 2001, pp. 1833-1839
Citations number
24
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON ELECTRON DEVICES
ISSN journal
00189383 → ACNP
Volume
48
Issue
8
Year of publication
2001
Pages
1833 - 1839
Database
ISI
SICI code
0018-9383(200108)48:8<1833:3SAAOE>2.0.ZU;2-U
Abstract
An advanced three-dimensional (3-D) self-assembling technique of surface mi cro-machined polysilicon structures is presented here for the realization o f dedicated actuators for optical applications such as micro-mirrors array with large deflection angles. Three-dimensional polysilicon microparts are self-assembled by beam buckling induced by integrated scratch drive actuato rs (SDAs), With this technique, 380 x 250 mum(2) microplates were lifted 90 mum above the substrate plane. Once the assembling is performed, the 3-D s hapes were held permanently by an integrated mechanical lock. Subsequent to the 3-D assembling, micro-mirrors were successfully actuated by biasing bu ried electrodes. Controlled motion up to +/- 15 degrees rotation was measur ed and analyzed by means of analytical models. Long-term actuations were ca rried out without any observable change, even for 0.5-mum thin polysilicon structures. This self-assembling technique of 3-D devices from surface micr o-machining opens new integration capabilities and new applications for mic ro-opto-electro-mechanical system (MOEMS).