For HFET application a series of samples with 30 nm AlxGa1-xN (x = 0.02-0.4
) layers deposited at 1040 degreesC onto optimised 2 mum thick undoped GaN
buffers were fabricated. The AlxGa1-xN/GaN heterostructures were grown on c
-plane sapphire in an atmospheric pressure, single wafer, vertical flow MOV
PE system. Electrical properties of the AlxGa1-xN/GaN heterostructures and
thick undoped GaN layers were evaluated by impedance spectroscopy method pe
rformed in the range of 80 Hz-10 MHz with an HP 4192A impedance meter using
a mercury probe. The carrier concentration distribution through the layer
thickness and the sheet carrier concentration were evaluated. A nondestruct
ive, characterisation technique for verification of device heterostucture q
uality from the measured C - V and G - V versus frequency characteristics o
f the heterostructure is proposed. (C) 2001 Elsevier Science B.V. All right
s reserved.