This paper presents the fabrication processes for micromachined millimetre-
wave devices, on two different types of semiconductor substrates. The first
process uses micromachining on high-resistivity < 100 > oriented silicon.
A three-layer dielectric membrane, with a total thickness of 1.5 mum is use
d as support for the millimetre-wave structures. This process was used for
the manufacturing of two coupled line filters, with central operating frequ
encies of 38 and 77 GHz, respectively. The second process is based on GaAs
micromachining. For the first time, a 2.2 mum thin GaAs/AlGaAs membrane. ob
tained by molecular beam epitaxy growth and micromachining of semi-insulati
ng < 100 > GaAs, is used as a support for millimetre-wave filter structures
. Cascaded coplanar waveguide open-end series stubs filter type structures,
with central frequencies of 38 and 77 GHz, respectively, were designed and
manufactured on a GaAs micromachined substrate. 'On wafer' measurements fo
r the filter structures were performed. Losses of less than 1.5 dB at 38 GH
z and less than 2 dB at 77 GHz have been obtained for both the silicon as w
ell as for the GaAs-based micromachined filters.