Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections

Authors
Blom, MT Chmela, E Gardeniers, JGE Berenschot, JW Elwenspoek, M Tijssen, R van den Berg, A
Citation
Mt. Blom et al., Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections, J MICROM M, 11(4), 2001, pp. 382-385
Citations number
9
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
ISSN journal
09601317 → ACNP
Volume
11
Issue
4
Year of publication
2001
Pages
382 - 385
Database
ISI
SICI code
0960-1317(200107)11:4<382:LABOKT>2.0.ZU;2-8
Abstract
Local anodic bonding of a common Kovar alloy to Pyrex is presented. This te chnique is ideally suitable for temperature-, solvent- and pressure-resista nt microfluidic connections. In this paper we mainly concentrate on the str ess problems occurring during and after bonding. Because of the different t hermal expansion coefficients of Kovar and Pyrex a structure is added in or der to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are inve stigated. In the latter case bonding for 3 h at 250 degreesC and 1.5 kV res ults in a high-quality bond.