Correlation between the morphology of Ag and the contact resistivity of the Ag/YBa2Cu3O7-delta thin film contact

Authors
Liu, T Zhao, YG Li, TB Zhu, MH Zhang, LW Huang, HS Liu, ML Zhou, YL He, M Lu, HB Cao, BS
Citation
T. Liu et al., Correlation between the morphology of Ag and the contact resistivity of the Ag/YBa2Cu3O7-delta thin film contact, J SUPERCOND, 14(3), 2001, pp. 455-459
Citations number
24
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF SUPERCONDUCTIVITY
ISSN journal
08961107 → ACNP
Volume
14
Issue
3
Year of publication
2001
Pages
455 - 459
Database
ISI
SICI code
0896-1107(200106)14:3<455:CBTMOA>2.0.ZU;2-B
Abstract
The morphology of the silver films deposited and annealed on laser ablated YBa2Cu3O7-delta thin films and the corresponding contact resistivity have b een systematically investigated. A minimum contact resistivity of 6 x 10(-8 ) Omega cm(2) was reached at 77 K by annealing Ag/YBa2Cu3O7-delta, contact at the optimum temperature. The effect of the annealing temperature on the contact resistivity was explained by considering the morphology of the silv er films and the diffusion of silver into YBa2Cu3O7-delta film, etc. The di fference of the contact resistivity for Ag contact to polycrystalline, sing le crystal and thin film of YBa2Cu3O7-delta were also explained.