Dense amorphous PLZT films with composition (Pb9.925La0.075) (Zr0.4La0.6) O
-3 were deposited on Pt/MgO (100) substrates by rf-magnetron sputtering wit
hout heating the substrates and were subsequently crystallized by postdepos
ition annealing. The optimum conditions in the two-step annealing process t
o crystallize the amorphous PLZT films were investigated. The post-depositi
on-annealed films showed excellent crystallinity and c-axis orientation whe
n the amorphous PLZT films were annealed in an oxygen flow at a soaking tem
perature for the initial nucleation process of T-1=300 degreesC, a temperat
ure for crystal growth process of T-2=750 degreesC, and the T-2-soaking tim
e of t(2)=60 min. Conventional Pt/PLZT/Pt capacitors were fabricated by for
ming Pt top electrodes on crystallized 300-nm-thick PLZT films. The remanen
t polarization and the coercive field of the present capacitors, which indi
cated almost symmetric P-E hysteresis loops, were 2P(r)=30 muC/cm(2) and 2E
(c)=90 kV/cm, respectively. The high-endurance PLZT capacitors with excelle
nt ferroelectric properties produced by the present optimized crystallizati
on have great potential for application to nonvolatile memory devices.