Deposition of electronic quality amorphous silicon, a-Si : H, thin films by a hollow cathode plasma-jet reactive sputtering system

Citation
G. Pribil et al., Deposition of electronic quality amorphous silicon, a-Si : H, thin films by a hollow cathode plasma-jet reactive sputtering system, J VAC SCI A, 19(4), 2001, pp. 1571-1576
Citations number
18
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
ISSN journal
07342101 → ACNP
Volume
19
Issue
4
Year of publication
2001
Part
2
Pages
1571 - 1576
Database
ISI
SICI code
0734-2101(200107/08)19:4<1571:DOEQAS>2.0.ZU;2-F
Abstract
High quality hydrogenated amorphous silicon, a-Si:H, thin films were deposi ted by means of a dc hollow cathode plasma-jet with magnetic field confinem ent. Single-crystal silicon nozzles were reactively sputtered in a high den sity hollow cathode discharge. Only nontoxic gases, argon and hydrogen, wer e used for this purpose. Different configurations of the dc hollow cathode were used for the deposition process. Electronic quality a-Si:H thin films were achieved with light to dark conductivity ratios > 10(6), with light co nductivity near 10(-5) S/cm and dark conductivity between 10(-11) and 10(-1 2) S/cm. This was accomplished with a specific configuration of the hollow cathode discharge in the silicon nozzle. Our best films have a Tauc band ga p near 1.8 eV and an atomic hydrogen concentration of about 14%. The growth rate achieved for the electronic quality a-Si:H films was in the range of 2-3 mum/h. (C) 2001 American Vacuum Society.