The need to reduce particles in semiconductor equipment and data storage eq
uipment is in high demand. In recent years, barrier and glue layers on shie
lds have been used to reduce particles generated in physical vapor depositi
on equipment. For this purpose, spray coatings are applied to shields. Alth
ough the sprayed metal films are exposed to vacuum in a vacuum chamber, the
ir vacuum characteristics have seldom been investigated. The conventional s
pray coatings are usually done under atmospheric conditions. In order to ob
tain a layer that has a better vacuum characteristic, spray coating in a ch
amber filled with an inert gas was developed. Outgassing characteristics of
sprayed aluminum films and titanium films were investigated by using the c
onductance modulation method. A sprayed metal film produced in an inert gas
system showed a lower outgassing rate than that produced in an atmospheric
condition. (C) 2001 American Vacuum Society.