Structural and electrical characteristics of chemical vapor deposited W/n-Si0.83Ge0.17/Si(001) and chemical vapor deposited WSix/n-Si0.83Ge0.17/Si(001)
Yc. Jang et al., Structural and electrical characteristics of chemical vapor deposited W/n-Si0.83Ge0.17/Si(001) and chemical vapor deposited WSix/n-Si0.83Ge0.17/Si(001), J VAC SCI A, 19(4), 2001, pp. 1046-1051
Structural and electrical properties of chemical vapor deposited (CVD) W/n-
Si0.83Ge0.17/Si(001) and CVD-WSix/n-Si0.83Ge0.17/Si(001) were studied by st
ructural, chemical, and electrical characterizations. W and WSix layers wer
e deposited on n - Si0.83Ge0.17/Si(001) and n-Si(001) at the growth tempera
ture T-s = 350- 550 degreesC by low-pressure chemical vapor deposition util
izing WF6 and SiH4 source gases. Structural and chemical properties of CVD-
W/n-Si0.83Ge0.17(001) and CVD-WSiX/n-Si0.83Ge0.17(001) interfaces were anal
yzed by x-ray diffraction, transmission electron microscopy, scanning elect
ron microscopy, Rutherford backscattering spectroscopy, and Auger electron
spectroscopy. Interfaces of CVD-WSix/n-Si0.83Ge0.17(001) were much sharper
than those of CVD-W/n-Si0.83Ge0.17(001). Interfaces of CVD-W/n-Si0.83Ge0.17
(001) are very rough presumably due to encroachment of SiGe layers caused b
y etching reaction of SiGe layers by WF6. Electrical properties of the CVD-
W/n-Si0.83Ge0.17(001) and CVD-WSix/n-Si0.83Ge0.17(001) Schottky diodes were
characterized by the current-voltage measurements. The measured effective
Schottky barrier heights (phi (Bn)) of the CVD-W/n-Si0.83Ge0.17(001) Schott
ky contacts were 0.56 +/-0.01 eV as the deposition temperature, T-s, of W l
ayers increases from 350 to 550 degreesC, and CVD-WSix/n-Si0.83Ge0.17(001)
Schottky contacts with CVD-WSix layers grown at T-s = 350 degreesC showed t
he phi (Bn) values similar to those of CVD-W/n-Si0.83Ge0.17(001). (C) 2001
American Vacuum Society.