Nano- and microchannel fabrication using column/void network deposited silicon

Nano- and microchannels are fabricated using a novel deposited column/void network silicon film as a sacrificial material. This nanostructured silicon consists of nanometer-sized columns defined normal to the substrate in a v oid matrix, where the voids are continuously connected with each other, for ming a network. The void network structure results in a high sacrificial la yer etch rate due to the void network-enhanced transport of reactant and re action products during the etching process, and high effective surface area . The use of our unique deposited column/void network material coupled with lift-off processing results in a manufacturable process for nano- and micr ochannel and nano- and microcavity fabrication. The approach provides extre mely flat surfaces without a chemical-mechanical polishing process, and all ows for multiple layers of channel or cavity structures with crossovers. (C ) 2001 American Vacuum Society.