CMOS-based microsensors and packaging

CMOS-based microsensors benefit from well-established fabrication technolog ies and the possibility of on-chip circuitry. In these devices, added on-ch ip functionality can be implemented, such as calibration, self testing, and digital interfaces. The paper summarizes major technological approaches to CMOS-based microsensors. Two packaged microsystems, namely a thermal image r and a chemical , microsystem, fabricated using CMOS technology in combina tion with bulk-micromachining and thin film deposition, are reviewed. Final ly, CMOS microsensors for the characterization and optimization of ball bon ding processes in the microelectronics packaging industry are presented. (C ) 2001 Elsevier Science B.V. All rights reserved.