Characteristics of metalorganic remote plasma chemical vapor deposited Al2O3 gate stacks on SiC metal-oxide-semiconductor devices

Citation
Hr. Lazar et al., Characteristics of metalorganic remote plasma chemical vapor deposited Al2O3 gate stacks on SiC metal-oxide-semiconductor devices, APPL PHYS L, 79(7), 2001, pp. 973-975
Citations number
16
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
00036951 → ACNP
Volume
79
Issue
7
Year of publication
2001
Pages
973 - 975
Database
ISI
SICI code
0003-6951(20010813)79:7<973:COMRPC>2.0.ZU;2-Q
Abstract
Metalorganic remote plasma chemical vapor deposited SiO2/Al2O3 stacks were deposited on 6H p-type silicon SiC to fabricate a high-k gate stack SiC met al-oxide-semiconductor capacitors. Capacitance-voltage (C-V) and current-vo ltage (I-V) measurements were performed. C-V characteristics showed excelle nt properties at room and higher temperatures. Samples exhibited a slight n egative flatband shift from which the net oxide charge (Q(ox)) was calculat ed. Low leakage currents were observed even at high temperatures. I-V chara cteristics of Al2O3 were superior to those observed on AlN and SiO2 dielect rics on SiC. (C) 2001 American Institute of Physics.