Nitrogen implantations for rapid thermal oxinitride layers

Citation
A. Stadler et al., Nitrogen implantations for rapid thermal oxinitride layers, MICROEL REL, 41(7), 2001, pp. 977-980
Citations number
6
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
41
Issue
7
Year of publication
2001
Pages
977 - 980
Database
ISI
SICI code
0026-2714(200107)41:7<977:NIFRTO>2.0.ZU;2-1
Abstract
Oxidation of nitrogen implanted substrates results in so called silicon-oxi nitride layers (SixOyN2 layers) which are dependent on implantation dose an d energy always thinner than pure silicon-oxides (SiO2) produced under the same oxidation conditions. Elastic recoil detection profiles indicate that the implanted nitrogen diffuses out of the substrate into the silicon-oxide layer what improves the electrical quality of these insulators. The SixOyN z layers show lower Fowler-Nordheim tunnelling currents as well as lower in terface state densities (D-it) than the corresponding SiO2 layers or N2O-si licon-oxinitride insulators. NH3-SixOyNz layers show the lowest D-it values because of H-2-annealing effects but contain fixed charges. (C) 2001 Elsev ier Science Ltd. All rights reserved.