The work provides experimental results of high energy electron irradiation
effects on silicon dioxide used for power MOS devices. A systematic increas
e of the threshold voltage has been observed in irradiated IGBT and VDMOS d
evices processed on Si < 100 > and Si < 111 >, respectively. The threshold
voltage shift has been interpreted as a result of the accumulated charge in
the gate oxide. Single event gate rupture has been observed and attributed
to the recoil ion interaction with the gate SiO2. The result has been corr
oborated by reliability stress tests. After electron irradiation, an increa
se in breakdown voltage appeared on all devices which was attributed to a c
hange in the surface impact ionisation coefficient. The change is most nota
ble in devices processed on Si substrate with < 111 > orientation. (C) 2001
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