The flat band voltage (V-fb) shift observed for MOS samples exposed to rapi
d thermal annealing (RTA) (N-2, 20 s, 1040 degreesC) is examined for (100),
(110) and (111) orientation-silicon substrates. Using a mercury gate C-V s
ystem, the V-fb shift can be attributed to changes in the electronic proper
ties of the oxide layer and not polysilicon gate effects, as had previously
been suggested. In addition, this work indicates that the flat band voltag
e shift results from a reduction of interface and fixed oxide charge due to
the RTA process. The interface and oxide charge densities are related to t
he density of available bonds for each surface orientation, both before and
after an RTA step. Based on these results, we argue that the V-fb shift fo
llowing RTA is primarily due to a reduction of fixed positive charge in the
oxide, and to a lesser degree, to a reduction of negative interface charge
. The net effect is that the RTA step reduces the total oxide charge densit
y. (C) 2001 Elsevier Science Ltd. All rights reserved.