COMPARISON OF TISI2, COSI2, AND NISI FOR THIN-FILM SILICON-ON-INSULATOR APPLICATIONS

TiSi2, CoSi2, and NiSi self-aligned silicide processes have been studi ed, compared, and applied to thin-film silicon-on-insulator technology . Compared to TiSi2, CoSi2 and NiSi have the advantages of wider proce ss temperature window, no significant doping retarded reaction, narrow runner degradation, and thin-film degradation. Therefore, they are mo re suitable for thin-film silicon-on-insulator technology. N-type fiel d effect transistors have been fabricated in a complementary metal oxi de-semiconductor compatible thin-film silicon-on-insulator technology with titanium, cobalt, and nickel self-aligned silicide processes for low-voltage, low-power microwave applications. The initial thicknesses of titanium, cobalt, and nickel are 30, 13, and 25 nm, respectively. The gate sheet resistances are 6.2, 4.4, and 2.9 Omega/square, respect ively, and the total source/drain series resistances are 700, 290, and 550 Omega mu m, respectively. High-frequency measurement results are also presented.