THERMODEL: A tool for thermal model generation, and application for MEMS

This paper presents a tool and a method for the generation of reduced order thermal models, in order to assure modeling the effect of the package on t he thermal behavior of the packaged device. The method is generic, and can be based either on the simulated or on the measured thermal transient respo nse of the real packages. It is based on the generation of the time constan t density spectrum of the thermal response function, from which we automati cally generate a reduced order thermal model in the form of an RC ladder ne twork model. Beyond presenting the generic methodology experimental results are also presented, based both on the simulation and measurement of MEMS e lements and packages.