A process for patterning ultrathin layers of PtSi with high spatial resolut
ion is presented. In this process, scanned probe anodic oxidation is used t
o pattern a surface oxide layer on a H-passivated Si surface. This oxide pa
ttern prevents the reaction of a deposited Pt film with the underlying Si i
n the formation of PtSi. The unreacted Pt on the oxide is removed by a sele
ctive etch before any annealing. This process greatly reduces lateral diffu
sion and produces a 2-nm-thick PtSi layer with good electrical properties t
hat maintains the fidelity of the patterned oxide mask. Such nanostructured
PtSi films are a good candidate for use in constructing lateral Si-based q
uantum devices. (C) 2001 American Institute of Physics.