Expanding the process window and reducing the optical proximity effect by post-exposure delay

Citation
Cy. Ku et al., Expanding the process window and reducing the optical proximity effect by post-exposure delay, J ELCHEM SO, 148(8), 2001, pp. G434-G438
Citations number
28
Categorie Soggetti
Physical Chemistry/Chemical Physics","Material Science & Engineering
Journal title
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
ISSN journal
00134651 → ACNP
Volume
148
Issue
8
Year of publication
2001
Pages
G434 - G438
Database
ISI
SICI code
0013-4651(200108)148:8<G434:ETPWAR>2.0.ZU;2-#
Abstract
In this investigation, a novel idea had been proposed to expand the process window and reduce the optical proximity effect (OPE) by employing post-exp osure delay (PED). Our previous work presented a model to specify the resis t linewidth according to PED time based on the neutralization mechanism of organic base and photogenerated acid. Based on the model, the exposure lati tude and depth of focus can be extended for various pattern sizes by applyi ng PED on linewidth broadening. Moreover, the dense-iso critical dimension bias, which is caused by OPE, can also be reduced when PED is performed. (C ) 2001 The Electrochemical Society. [DOI: 10.1149/1.1383557] All rights res erved.