X-ray synchrotron topography investigation of porous silicon formed by patterning in localized areas

Citation
S. Milita et al., X-ray synchrotron topography investigation of porous silicon formed by patterning in localized areas, J ELCHEM SO, 148(8), 2001, pp. G439-G446
Citations number
35
Categorie Soggetti
Physical Chemistry/Chemical Physics","Material Science & Engineering
Journal title
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
ISSN journal
00134651 → ACNP
Volume
148
Issue
8
Year of publication
2001
Pages
G439 - G446
Database
ISI
SICI code
0013-4651(200108)148:8<G439:XSTIOP>2.0.ZU;2-8
Abstract
X-ray synchrotron topography was used to study the structural features of p orous silicon (PS) layers formed by p(+) (boron)-type silicon anodization w ithin localized areas. Selective anodization was obtained by using a maskin g film (Si3N4) with good chemical inertness to the anodic dissolution or a surface layer of different doping type and level resulting from phosphorus implantation. The overall structural picture of the PS/substrate systems ob tained by the two different masking procedures was built up by combining di fferent topographic methods. The samples were oriented both in Bragg (refle ction) and Lane (transmission) geometry to diffract white or monochromatic radiation with extended (projection topography) or limited (section topogra phy) beam widths. By comparing the effects of the two masking types on the anodization process, the implantation method is unquestionably preferable b ecause of the lower stress at the window edges, the better lateral porosity homogeneity inside the windows, and the flatter interface between porous s ilicon and substrate. (C) 2001 The Electrochemical Society. [DOI: 10.1149/1 1385380] All rights reserved.