Y. Mizuno et al., Effect of milling process on core-shell microstructure and electrical properties for BaTiO3-based Ni-MLCC, J EUR CERAM, 21(10-11), 2001, pp. 1649-1652
The effect of the process parameter in the milling process on the microstru
ctural evolution and the electrical properties of multilayer ceramic capaci
tor (MLCC) samples were investigated in the BaTiO3 (BT)-Ho2O3-MgO system. T
he microstructure for MLCC samples fired at 1320 degreesC was dependent on
the degree of damage for BT given by the milling process, judging from the
field emission scanning electron microscopy observation and differential sc
anning calorimetry measurement (DSC). The mean grain size (D-50) determined
from the chemically etched samples decreased as the damage increased. The
endothermic peak of DSC profile at around 125 degreesC was broadened and th
e peak area decreased as the damage increased. Furthermore, the electrical
properties were dependent on the degree of damage. The dielectric constant
for MLCC samples decreased and the peak of dielectric constant at around ro
om temperature shifted to a higher temperature as the damage increased. It
was found that the MLCC sample showed the small leakage current and long me
an lifetime as the degree of damage increased. (C) 2001 Elsevier Science Lt
d. All rights reserved.