Semiconductor ceramics for NTC thermistors: the reliability aspects

Citation
H. Altenburg et al., Semiconductor ceramics for NTC thermistors: the reliability aspects, J EUR CERAM, 21(10-11), 2001, pp. 1787-1791
Citations number
8
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY
ISSN journal
09552219 → ACNP
Volume
21
Issue
10-11
Year of publication
2001
Pages
1787 - 1791
Database
ISI
SICI code
0955-2219(2001)21:10-11<1787:SCFNTT>2.0.ZU;2-A
Abstract
Thermally induced processes in ceramic-electrode interfaces of CuxNi1-x-yCo 2yMn2-yO4-based NTC thermistors as a function of their chemical composition s and quantitative parameters of low-temperature annealing at 400-800 degre es C are studied. Thermal treatment of thermistors at 400-600 degrees C dur ing 15 h leads to degradation of the metallization layers for the majority of the investigated samples owing to the migration of electrode material (s ilver) into ceramic body. An accompanying anomalous increase of thermistors ' electrical conductivity is observed. The following thermal treatment duri ng 15 h at 800 degrees C leads to an electrical conductivity regeneration t o, approximately, the initial values. The reversible nature of this phenome non is confirmed by Auger-spectroscopy method. Some of the studied NTC ther mistors appear to be stable to low-temperature thermal treatment. These com positions are proposed for applications in devices operating at the tempera tures up to 530 degrees C. (C) 2001 Elsevier Science Ltd. All rights reserv ed.