Low-temperature co-fired ceramic (LTCC) materials offer a good possibility
to bury passive components and to produce compact electronic circuits. Thes
e properties were utilised in this study to realise a passive band-pass RF
filter in the LTCC module. The filter consisted of planar inductors, capaci
tors and microstrip lines. The component values of the filter structure wer
e determined by using the APLAC circuit simulator, Commercial fine-line thi
ck-film Au paste and shrinkage-matched LTCC Ag pastes were used to print na
rrow conductor lines by gravure-offset-printing on different LTCC sheets. N
arrow conductor lines down to 50 mum wide were printed successfully without
shrinkage mismatch during firing. A network analyser and different microsc
opes were used to study, respectively, the electrical and material properti
es of the patterns and filters. Variations of the printed line widths and o
f the electrical values of the patterns and filters were about +/- 10%. The
highest centre frequency of the realised filters was about 2 GHz. (C) 2001
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