Preparation of Ag-Cu/Ni/Ag-Cu clad tapes for YBCO superconducting tape andits textured properties

Citation
H. Yoshino et al., Preparation of Ag-Cu/Ni/Ag-Cu clad tapes for YBCO superconducting tape andits textured properties, PHYSICA C, 357, 2001, pp. 923-930
Citations number
16
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
PHYSICA C
ISSN journal
09214534 → ACNP
Volume
357
Year of publication
2001
Part
2
Pages
923 - 930
Database
ISI
SICI code
0921-4534(200108)357:<923:POACTF>2.0.ZU;2-Z
Abstract
The Ag clad tape consisting of Ag-0.1%Cu and some Ni alloys was prepared. T he textured property, the proof stress at high temperature and the supercon ductivity of YBa2Cu3 (YBCO) film deposited by PLD were studied. The uniform clad tape with a length of 10 m and a thickness of 0.1 nun was obtained an d it showed the textured structure of (210)(120) after annealing at 700 deg reesC. YBCO filmdeposited on the textured clad tape was aligned in-plane. F rom two to four times higher proof stress sigma (0.2) at 700 degreesC than that of Ag was obtained by cladding. High J(c) value of about 10(5) A/cm(2) was obtained on Ag-0.1%Cu/Ag-10%Ni clad tape. (C) 2001 Elsevier Science B. V. All rights reserved.