H. Yoshino et al., Preparation of Ag-Cu/Ni/Ag-Cu clad tapes for YBCO superconducting tape andits textured properties, PHYSICA C, 357, 2001, pp. 923-930
The Ag clad tape consisting of Ag-0.1%Cu and some Ni alloys was prepared. T
he textured property, the proof stress at high temperature and the supercon
ductivity of YBa2Cu3 (YBCO) film deposited by PLD were studied. The uniform
clad tape with a length of 10 m and a thickness of 0.1 nun was obtained an
d it showed the textured structure of (210)(120) after annealing at 700 deg
reesC. YBCO filmdeposited on the textured clad tape was aligned in-plane. F
rom two to four times higher proof stress sigma (0.2) at 700 degreesC than
that of Ag was obtained by cladding. High J(c) value of about 10(5) A/cm(2)
was obtained on Ag-0.1%Cu/Ag-10%Ni clad tape. (C) 2001 Elsevier Science B.
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