DISSOLVING OF NICKEL IN A THIN-LAYER OF PD-SI MELT

The general mechanisms of the process of nickel dissolving in a thin l ayer (50-100 mu m) of Pd-Si (1.5-4.0 wt. ro Si) melt at 1000 degrees C was studied. The solubility of nickel is limited by the elements allo ying palladium, namely silicon and zinc (0.4-0.9 wt.%). An increase of nickel content of the melt on increasing the duration of heat treatme nt from 2 to 60 min was observed. Increasing the silicon content of th e initial Pd-Si alloy increases the nickel content of the solid soluti on (1.0-3.1 wt.%) and of the eutectic (0.25-0.6 wt.%) in the coating ( 10 min). This was attributed to the strong chemical interaction in the Ni-Si system.