All-additive fabrication of inorganic logic elements by liquid embossing

Citation
Ca. Bulthaup et al., All-additive fabrication of inorganic logic elements by liquid embossing, APPL PHYS L, 79(10), 2001, pp. 1525-1527
Citations number
30
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
00036951 → ACNP
Volume
79
Issue
10
Year of publication
2001
Pages
1525 - 1527
Database
ISI
SICI code
0003-6951(20010903)79:10<1525:AFOILE>2.0.ZU;2-K
Abstract
We report an all-additive patterning technique, liquid embossing, in which a thin liquid film is embossed by an elastomeric stamp. We show that, for s ufficiently thin films, isolated features are produced as the stamp contact s the underlying substrate, and that the liquid remains patterned even afte r removal of the stamp. Such an approach enables the rapid patterning of in organic nanocrystal solutions, as capping groups and solvents can volatiliz e efficiently at the exposed liquid surface. Using this technique, we have fabricated all-printed all-inorganic transistors, photodetectors, and resis tors, as well as multilayer structures with sacrificial layers and vias. Su ch an approach may enable a route to all-printed inorganic semiconductor lo gic and machines. (C) 2001 American Institute of Physics.