APPLICATION OF MICROMECHANICAL POLYCRYSTALLINE MODEL IN THE STUDY OF THRESHOLD STRESS EFFECTS ON SUPERPLASTICITY

Citation
N. Chandra et al., APPLICATION OF MICROMECHANICAL POLYCRYSTALLINE MODEL IN THE STUDY OF THRESHOLD STRESS EFFECTS ON SUPERPLASTICITY, Materials science & engineering. A, Structural materials: properties, microstructure and processing, 231(1-2), 1997, pp. 134-142
Citations number
17
Categorie Soggetti
Material Science
ISSN journal
09215093
Volume
231
Issue
1-2
Year of publication
1997
Pages
134 - 142
Database
ISI
SICI code
0921-5093(1997)231:1-2<134:AOMPMI>2.0.ZU;2-Y
Abstract
The mechanical behavior of superplastic materials is characterized by a sigmoidal curve (regions I, II and III) spanning about seven to eigh t decades of strain rate in log sigma - log (epsilon) over dot plot. M ost of the superplastic deformation models cover only the superplastic regime (region II), over a small range of strain rate. We have previo usly proposed a model based on micromechanics to predict the mechanica l behavior of material in regions II. In this work the model is modifi ed to cover all the three regions and to predict the presence or absen ce of superplasticity in a given material. The new model incorporates a threshold stress term for diffusional flow at the atomic level which manifests as the experimentally observed threshold stress at the macr o level. The model is applied to superplastic materials including stat ically recrystallized 7475 aluminum alloy, dynamically recrystallizing 2090-OE16 aluminum-lithium alloy and an Al-Zn-Mg-Cu alloy. With the i ntroduction of the threshold stress, the influence of grain size and t emperature on the behavior of these materials can be predicted over a wider range of strain rate. Also the maximum strain-rate sensitivity a nd its corresponding strain rate can be fairly accurately predicted. T he variation of threshold stress with respect to grain size and temper ature is also studied and an activation energy term is suggested for d escribing the threshold phenomenon, (C) 1997 Elsevier Science S.A.