Development of single step grinding system for large scale phi 300 Si wafer: A total integrated fixed-abrasive solution

This research has developed an integrated manufacturing system for phi 300m m silicon wafer, using fixed abrasive instead of conventional free slurry, to provide a totally integrated solution for achieving the surface roughnes s R-a < 1nm (R-y < 5 similar to 6nm) and the global flatness < 0.2 mum/phi 300mm. In addition to the space saving, this integrated system also signifi cantly reduces the total energy consumption by 70%, compared with the curre nt process used for phi 200mm Si wafer. Three core technologies: the hybrid process mechanics, the GMM (giant magnetostrictive material) actuated posi tioning/alignment device and the ecologically friendly coolant circulation system are described in this paper. The system performance and results are then presented and discussed.