A wirebonding technique is presented for designing a single-layer miniature
and broadband microstrip antenna on the basis of experiments. The techniqu
e most commonly applied in device assembly will support manufacturing and p
ackaging of small antennas by avoiding via-holes. Consisting of three short
-circuited elements fed by a parasitic wirebonding configuration, the anten
na in a package format has the merits of wide impedance bandwidth, miniatur
e structure, flexible matching and easy integration into RIF front-end unit
s. Its stable and broadside copolarised radiation patterns in the frequency
range of 2.40-2.51 GHz are satisfactory for Bluetooth application.