Q. Li et al., RF circuit performance degradation due to soft breakdown and hot-carrier effect in deep-submicrometer CMOS technology, IEEE MICR T, 49(9), 2001, pp. 1546-1551
Citations number
11
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
A systematic study of RF circuit performance degradation subject to oxide s
oft breakdown (SBD) and hot-carrier (HC) stress is presented in this paper.
DC and RE characteristics before and after stress are extracted from the e
xperimental data. The effects of SBD and HC stress on s-parameters, cutoff
frequency, third-order interception point, and noise parameters are examine
d. The performance drifts of gain, noise figure, linearity, and input match
ing of the RF low-noise amplifier are demonstrated by SpectreRF simulation
results based on measured device data.