RF circuit performance degradation due to soft breakdown and hot-carrier effect in deep-submicrometer CMOS technology

Citation
Q. Li et al., RF circuit performance degradation due to soft breakdown and hot-carrier effect in deep-submicrometer CMOS technology, IEEE MICR T, 49(9), 2001, pp. 1546-1551
Citations number
11
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
ISSN journal
00189480 → ACNP
Volume
49
Issue
9
Year of publication
2001
Pages
1546 - 1551
Database
ISI
SICI code
0018-9480(200109)49:9<1546:RCPDDT>2.0.ZU;2-T
Abstract
A systematic study of RF circuit performance degradation subject to oxide s oft breakdown (SBD) and hot-carrier (HC) stress is presented in this paper. DC and RE characteristics before and after stress are extracted from the e xperimental data. The effects of SBD and HC stress on s-parameters, cutoff frequency, third-order interception point, and noise parameters are examine d. The performance drifts of gain, noise figure, linearity, and input match ing of the RF low-noise amplifier are demonstrated by SpectreRF simulation results based on measured device data.