Highly selective photoelectrochemical etching of nitride materials for defect investigation and device fabrication

Citation
P. Visconti et al., Highly selective photoelectrochemical etching of nitride materials for defect investigation and device fabrication, J VAC SCI B, 19(4), 2001, pp. 1328-1333
Citations number
31
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
ISSN journal
10711023 → ACNP
Volume
19
Issue
4
Year of publication
2001
Pages
1328 - 1333
Database
ISI
SICI code
1071-1023(200107/08)19:4<1328:HSPEON>2.0.ZU;2-J
Abstract
Photoenhanced electrochemical (PEC) etching in an unstirred KOH solution un der He-Cd laser illumination was used for delineating extended defects in G aN films. When a low-excitation intensity was employed, the process yielded threading vertical features at dislocation sites. Application of an extern al voltage or a higher-illumination intensity led to high-etch rates with s mooth surfaces. Some highly resistive samples, for which no etching was obt ained under normal etching conditions, could be etched with the application of a single-polarity external voltage. Finally, in a GaN sample with an Al N/GaN superstructure inside, high selectivity between AIN and GaN was achie ved; in this case, the PEC process stopped at the thin AIN stop layer. (C) 2001 American Vacuum Society.