Mechanical behavior of copper with a submicrocrystalline structure

The effect of postdeformation short-term low-temperature annealings and sma ll plastic deformation by tension below the temperatures of the onset of re crystallization on the mechanical properties and specific features of the d eformation-induced strengthening of commercial copper with a submicrocrysta lline (SMC) structure was studied. It was found that the SMC structure form ed upon severe plastic deformation could be strongly strengthened by this d eformation, It was shown that the changes in the intensity of the deformati on-induced strengthening of the SMC copper was determined by the defect str ucture of the grain boundaries and of the bulk of grains. A decrease in the defect density due to controlled annealing or a small preliminary deformat ion at an elevated temperature resulted in an appreciable increase in the r ate of the deformation-induced strengthening and, as a consequence, ensured the excellent properties of the SMC copper at room temperature. The data o n the effect of the treatments performed on the mechanical properties sugge st that a small plastic deformation of the SMC copper at a temperature that is somewhat lower than the temperature of the onset of recrystallization c an be a promising method to improve the structure, retaining the fine grain .