Three-dimensional MMIC technology for low-cost millimeter-wave MMICs

This paper highlights the key advantages of the three-dimensional (3-D) MMI C technology in the millimeter-wave frequency band and describes recently d eveloped compact 3-D MMICs on GaAs and Si substrates. The 3-D MMIC technolo gy offers high integration levels, compactness, simple design procedures, a nd short fabrication turn-around time, resulting in millimeter-wave MMICs a t greatly reduced cost. This paper also proposes a new methodology for MMIC development based on 3-D/multilayer MMIC technology that accelerates the c ost reduction of millimeter-wave MMICs. The new technology achieves compact and highly integrated millimeter-wave MMICs that are extremely cost effect ive.