We give an overview of the state-of-the-art of heterostructure RF-device si
mulation for industrial application based on III-V compound semiconductors.
The work includes a detailed comparison of device simulators and current t
ransport models to be used, and addresses critical modeling issues. Results
from two-dimensional hydrodynamic simulations of heterojunction bipolar tr
ansistors (HBTs) and high electron mobility transistors (HEMTs) with MINIMO
S-NT are presented in good agreement with measured data. The simulation exa
mples are chosen to demonstrate technologically important issues which can
be addressed and solved by device simulation.