A characterization technique for homogeneity of piezoelectric wafers utiliz
ing bulk-wave measurement was established. and measurements were carried ou
t on langasite (LGS: La3Ga5SiO14) wafers fabricated in our laboratory. The
technique is capable of predicting the homogeneity of the phase velocity of
a surface acoustic wave (SAW), which determines the deviation of the centr
al frequencies of SAW devices, by measuring the distribution of the frequen
cy constant of thickness-shear mode resonance. The frequency constant, meas
ured by a combination of resonance frequency measurement and thickness meas
urement in a single wafer, yields a relative accuracy of about +/- 55 ppm.
The distribution of the frequency constant is consistent with that of the p
hase velocity of SAW obtained by fabricating and measuring SAW devices. The
method is both rapid and nondestructive. thus is suitable for routine char
acterization in the production of piezoelectric wafers. Characterization of
langasite wafers using this technique correlated inhomogeneity to the grow
th conditions of the crystal.