Simulation study on semiconductor coupled surface acoustic wave convolver through a multi-strip electrodes

This paper presents results of simulation Study on a semiconductor coupled surface acoustic wave (SAW) convolver, in which the propagating SAW on a hi ghly coupling coefficient piezoelectric substrate, couples with a bonded se miconductor diodes through multi-strip electrodes. We focus our study on a relatively wide band device which is the main feature of a highly efficienc y device. By using a simple analysis and circuit simulator. based on the si mulation program with integrated circuit emphasis (SPICE), we clarified the effect of device parameters, such as the shape of multi-strip tapping elec trodes, characteristics of diode, impedance matching condition, kinds of tr ansmission code and electro-mechanical coupling coefficient of SAW. on the device performances. We discussed the phenomenon, which cause the degradati on. focusing on the frequency domain. We also clarified the essential probl ems of second order effect on the wide bandwidth device. which should be so lved.