The national project of "Ultra High-Density Electronic System Integgration"
was initiated in 1999. This is the first project to focus on a niche area
between electronic devices and systems. It aims to develop technologies for
overcoming the problems in terms of performance of electronic systems. Thr
ee-dimensional (3D) LSI chip stacking, optoelectronics hybrid integration,
and optimum circuit design are the technology categories. For the 3D stacki
ng technology, a chip-based stacking technology is under extensive developm
ent that includes wafer preparation for chip stacking, wafer thinning, chip
stacking, and inspection and testing. In this paper, the current developme
nt status of the 3D stacking technology, called V-STACK technology, is intr
oduced.