The hardness of single-crystal aluminum nitride (AlN) 0.5-mm-thick wafers w
as measured at elevated temperatures and compared with that of other semico
nductors. A Vickers indentation method was used to determine the hardness u
nder an applied load of 0.5-5 N in the temperature range 20-1400 degreesC.
The average hardness was measured as 17.7 GPa at room temperature. AIN exhi
bits a hardness higher than that of GaN in the entire temperature range inv
estigated. A high mechanical stability for AIN at high temperatures is dedu
ced.